PROFILE
Experienced team leader with 21 years experience in the PCB Industry. Successful PCB designer for Switched Mode Power Supplies and Mobile Phones products.
Supervising and organising the introduction of new PCB technologies and CAD Tools.
Mentoring and coaching PCB Engineers to improve their design capabilities and ultimately design quality.
Excellent leadership skills with a methodical approach to planning and organisation. Strong focus to delivering projects on time and meeting the requirements.
KEY SKILL AND COMPETENCES
PCB Design using latest PCB technologies; PCB Manufacturing and Assembly Knowledge; PCB Design Tools Used–Mentor Graphics PADS & Boardstation, Zuken CR5000; Mechanical and Thermal Design Tools – Solidworks, AutoCAD, Flow Simulation; Communication and Leadership
Methodical approach to planning and organisation; strong Decision Making
CAREER
Oct 2012–Present
TDK-Lambda Advanced Technology Centre, Bristol, UK
Senior Mechanical/PCB Designer
General activities:
Assisting with the development of new Power Supply Concepts by creating PCB layouts. Identifying best thermal simulation tool for PCB Design. Various tools reviewed (IcePak, Flotherm, COMSOL, Flow Simulation)
Identifying new substrate solutions and materials to meet the thermal challenges for future products. Copper coin technology PCB`s designed, manufactured with high thermal conductivity material and tested.
Key Achievements:
Successful, on-time, high quality PCB designed; Identification of PCB technologies such as copper coins and high thermal conductivity materials to overcome thermal challenges
Creation of new Design Standards for low voltage designs; PCB Technology evaluation boards designed and used in verification process
Mechanical drawings for transformer, chokes and heatsinks
2002-Sept 2012
Nokia UK /Southwood, UK
Nokia GmbH – R&D Center / Ulm – Germany
PCB and FPC Operational Leader
General activities:
Global position with responsibilities covering all R&D Sites. Focused to ensuring the quality of PCB’s designed were at a high level to meet Product requirements and within cost targets.
Global Owner for Standards, Specifications and Design Process that guided the PCBdesign principles used for all PCB’s within the Company. New technologies such as Rigid-Flex required new Standards and Guidelines so it could be included in Products
Driving and leading CAD Tool Evaluations, conducted in close cooperation with CAD
Tool Partners. Schematics for new products were designed as part of a Schematic
Capture and Data Management Tool Evaluation. Both Tools became standard for the Company.
Engaging and leading local and virtual teams of varying sizes to achieve best results in all work. Small teams could be 2 people as with the CAD Evaluation on Zuken System
Key Achievements:
Design Quality improvements across all R&D Sites; Standards, Specification and Process Ownership supported by PWB Manufacturers
1999-2002
Nokia Japan – R&D Center / Tokyo – Japan
PCB Team Leader
General activities:
PCB Team Leader requested to build a new PCB Design team and Design Environment in a new R&D Center in Japan.
The PCB Team supported several Products in a highly professional manner succeeding in realising successful products launches.
Key Achievements:
Creation of a professional, reliable PCB Design Team
Successful program execution with new, inexperienced team
EDUCATION
1985 – 1990 Paisley College of Technology, Paisley, Scotland, UK
B Eng (Hons) Degree Electrical and Electronic Engineering
