CV, Senior PCB Layout Designer Looking Globally

Available
Serial No: 30047
Skills keywords: 
Current location:  Karnataka, India - View on map
Nationality: indian
Spoken languages: english, Hindi, KANNADA

PCB DESIGNER ENGINEERING PROFESSIONAL – PCB Technology

Objective

To pursue a career as PCB Designer and also to achieve higher standards in efficiency and excellence by exercising the best skills to attain the vision of the organizations, both individually and as a team player.

Industry Preference: PCB Layout Design

Profile

• Dynamic professional offering over 4.5 years of rich experience in PCB Design Engineering

• Well versed with the concept of PCB layout using Mentor Graphics Expedition DX-Designer, Library Management, Design Capture, Allegro and Orcad.

• Major clients handled: Honeywell, Cognizant, L&T .and for other companies

• Strong knowledge of PCB designing process and methodologies.

• Excellent written and oral communication skills with an ability to team up with Engineering and Manufacturing department to ensure the highest quality PCB design developments

• Ability to estimate the scope of PCB Design efforts and predict milestones and schedules

Knowledge Preview

• All types of Board’s, Interface Board’s, Power supply Board, Flex, Rigid and Customized Boards

• Surface mount & through hole designs with micro via technology

• Checking/verification of designs before release to FAB

• Ability to handle the complete design cycle of the PCBs from ‘Schematic’ to ‘Fabrication’ as per IPC standards.

Skill Set

Schematic Software

• Orcad from Cadence – Version 16.3,16.4,16.5,16.6

• Mentor Graphics DX-Designer – Version 2004, 2007.4, 2007.3,2007.5, 2007.7, 2007.8 and 2007.9

• Design Capture – Version,2004,2007.3,2007.4,2007.7 2007.8,and 2007.9

Cam Software

• View mate -Version 10.0.1

• Cam 350 -Version 9.1.1

Design Software

• Mentor Graphics Expedition – Version 2004 2007.3,2007.5, 2007.7,2007.8 and 2007.9

• Cadence Allegro – Version 16.3,16.4,16.5,16.6

Major Accomplishments

• Worked on high density Boards with up to 14 layers and with BGA (1mm pitch).

• Adroitly documented details for PCB fabrication and assembly, including Gerber Files, Fabrication Drawings, Assembly Drawings and Paste Masks

Core Competencies

• Understanding the driving PCB technology and process trends and their application to designs

• Maintaining technical coordination with Engineering, Products Design, Test, EMC Engineering and Manufacturing

• Resolving PCB design issues with fabrication and manufacturing vendors.

• Proactively participating in the evolution and definition of circuit design for (DFM) guidelines

• Participating and providing input into the PCB design specifications and standards with respect to product design, electrical design, manufacturing and various regulatory agency requirements

Work Experience

Dec 2014- April-2015:
HCL Technologies Ltd, Chennai as Sr. PCB Design Engineer. (Contract)

Role:

• Involved in Projects with team member for in-house.

• Requirement Analysis. – Understanding the requirements in right direction by applying the knowledge gained during previous releases.

• Interacting with the mechanical team for assembly and mounting requirement.

• Schematic creation, Layout Design, Constraints Settings, Gerber verification and Package creation

• Interacting with the EE team & Customer for implement new requirements.

• Handling onsite projects for different MNC based company’s customers like Alstom.

August 2011- Dec-2014 :
Sienna Ecad Technologies Pvt. Ltd., Bangalore as PCB Design Engineer.

Role:

• Involved in Projects with team member for in-house.

• Schematic creation, Layout Design, Constraints Settings, Gerber verification and Package creation

• Co-ordination with Customer & EE Team for Implementing new Requirement

• Handled onsite projects for different MNC based company’s customers.

January 2011- July 2011:
Span wave Technology Solutions Pvt. Ltd., Bangalore as Trainee Design Engineer.

Role:

• Understand the process of PCB Layout Design and Schematic capture.

• Completed 4 Layer power supply card independently.

• Involved in Placement and Routing with team members.

Please refer to the annexure for some of the projects handled during my tenure at different organizations

ANNEXURE

Product: LON Design cards

Tool(s) used: Design Capture & Expedition

Client: Cognizant Technology Solutions

Board Complexity: These boards will run in schindler lifts. 4-6 layer cards with FT5000 Microcontroller. & power supply Placement. Designed around 20 boards.

Key Accomplishments: Schematic capture, Board creation, Database creation, Placement, constraints settings, Routing,

Graphic Editing Gerber generation

Product: Automotive Industries

Tool(s) used: DX-Designer & Expedition

Client: L&T

Tool(s) used: DX-Designer & Expedition (2007.9.3)

Board Complexity: 2-4 Layer cards Boards are designed for automotive products Board sizes are small minimum

120mm x 6mm.Mechanical constraints for Placement & Routing in bending areas.

Key Accomplishments: Schematic capture, Board creation, Database creation, Placement, constraints settings, Routing,

Graphic Editing Gerber generation

Product: Interface Card.

Tool(s) used: DX-Designer & Expedition (2007.9.4)

Client: COMAVIA Technology Solutions Pvt Ltd

Board Complexity: 12 Layer Card, 650MHz, 400 pin 1.0 mm Pitch Bga, Flash, DDR2 interface, SI constraints, Critical Nets & mixed signal Analog & Digital.

Key Accomplishments: Schematic capture, Board creation, Database creation, Placement, constraints settings, Routing, Graphic Editing Gerber generation

Product: Automation & Control card.

Tool(s) used: DX-Designer & Expedition (2007.9.4)

Client: Honeywell Technology Solutions Pvt Ltd

Board Complexity: 8-Layer Card, Mechanical Placement constraints for Edge connectors. Impedance signals 50 ohms, 90 oms & 100 ohms. Routing for Power supply & isolation.

Key Accomplishments: Schematic capture, Board creation, Database creation, Placement, constraints settings, Routing, Graphic Editing Gerber generation

Product: Memory control & I/O Design.

Tool(s) used: Cadence Allegro 16.5 & Orcad capture.

Client: Open Silicon

Board Complexity: 10-Layer Card, Mechanical constraints. 1.2GGHz. DDR2 Interface. Critical Nets Routing

Power supply routing & Ground isolation.

Key Accomplishments: Schematic capture, Board creation, Database creation, Placement, constraints settings, Routing, Graphic Editing Gerber generation.

Product: Automotive Industries

Tool(s) used: DX-Designer & Expedition (2007.9.4)

Client: Caterpillar

Board Complexity: 8-Layer Card, Mechanical Placement constraints for Edge connectors. Impedance signals 50 ohms, Routing for Power supply & isolation.

Key Accomplishments: Schematic capture, Board creation, Database creation, Placement, constraints settings, Routing, Graphic Editing Gerber generation.

Product: Power supply Cards

Tool(s) used: DX-Designer & Expedition (2007.9.4)

Client: Refusol Technology Solutions

Board Complexity: 4-6 Layer Cards, 25-Amps current. Microcontroller IC .Power supply placement & isolation for power supply.

Key Accomplishments: Schematic capture, Board creation, Database creation, Placement, constraints settings, Routing, Graphic Editing Gerber generation..

Education

Diploma – Electronics & Communication from K.H.Kabbur Institute of Engineering with the Aggregate of 58% In the year 2010 from Dharwad

Personal Details

Date of Birth: 7th December 1988

Nationality: Indian.

Languages Known: English, Hindi, and Kannada

Marital Status: Single

Passport Details: H7543965; Valid till 22nd Sept 2019.

 

 

 

 

 






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